1. Taw qhia
Raws li pixel suab hauv LED video phab ntsa txuas ntxiv mus rau qis dua 1.5mm, kev tiv thaiv txhua yam, kho qhov muag sib xws, thiab thermal dissipation tau dhau los ua cov teeb meem tseem ceeb hauv engineering. Cov khoom ntim khoom ntim khoom nto moo nto moo (SMD) tau ua haujlwm ntev los ua tus qauv kev lag luam, tab sis cov txheej txheem tshiab dua -tshwj xeeb Glue- ntawm -Board (GOB) thiab Chip- ntawm -Board (COB)- tau tshwm sim los daws nws lub cev tsis zoo. Kev nkag siab txog cov qauv thiab kev ua lag luam- tawm ntawm SMD, GOB, thiab COB yog qhov tseem ceeb thaum qhia meej cov lus qhia rau chav tswj, tshaj tawm cov studios, chaw sib tham, thiab siab - ib puag ncig kev tsheb.
2. Cov txheej txheem kev tsim vaj tsev thiab kev tsim khoom
SMD (Nto Mount Ntaus)
SMD tseem yog tus qauv ntim khoom loj tshaj plaws. Tus kheej RGB diodes yog encapsulated nyob rau hauv ib lub hnab yas / resin pob vaj tse txhuas thav ntawv, uas yog ces soldered ncaj qha mus rau lub Printed Circuit Board (PCB) siv automated nto mount technology (SMT).
- Txoj kev sib khi:Solder pads ntawm reflow soldering.
- Pixel suab haum:Feem ntau tus qauv ntawm P1.2 txog P10 thiab siab dua.
- Lub cev profile:Ib tug neeg tsa tej pob khoom raug ncaj qha rau ntawm lub vaj huam sib luag nto.
GOB (Glue-ntawm-Board)
GOB sawv cev rau cov txheej txheem tiv thaiv thib ob siv rau cov qauv SMD cov qauv. Tom qab SMD diodes raug soldered rau PCB, ib txheej ntawm optical -qib epoxy resin los yog polyurethane nplaum yog cam khwb cia thoob plaws tag nrho cov saum npoo ntawm lub rooj tsavxwm, encapsulating cov diodes raug thiab solder pob qij txha.
- Txoj kev sib khi:Pa SMD reflow soldering ua raws li cov kua potting / curing txheej txheem.
- Pixel suab haum:Feem ntau hauv P1.25 txog P2.5 qhia qhov twg yuav tsum muaj kev tiv thaiv ntxiv.
- Lub cev profile:Ib qho txuas ntxiv, ib nrab- pob tshab pob tshab tiv thaiv txheej nrog los yog me ntsis saum cov pob SMD.
COB (Chip-ntawm-Board)
COB tshem tawm cov pob khoom diode nkaus xwb. Bare semiconductor LED chips yog mounted ncaj qha mus rau PCB substrate, interconnected siv micro-hlau bonding los yog flip{2}}chip cov tswv yim, thiab tom qab ntawd encapsulated raws li ib tug array integrated nrog optical resin.
- Txoj kev sib khi:Direct tuag-Txuas thiab xaim sib txuas (lossis tig-chip bonding) rau lub rooj tsavxwm.
- Pixel suab haum:Feem ntau tsim kho rau sub-P1.5 configurations (P1.2, P0.9, P0.6, thiab me dua).
- Lub cev profile:Ua tiav tiaj tus, lub npoo npoo tsim ib lub ntsej muag kho qhov muag.
3. Kev sib piv Engineering
| Parameter | Ib txwm SMD | GOB (Glue-ntawm-Board) | COB (Chip-ntawm-Board) |
|---|---|---|---|
| Lub cev Durability | Tsawg; diodes yooj yim khob tawm thaum tuav | Siab; muaj zog tiv thaiv kev cuam tshuam, kev co, thiab khawb | Siab; unified solid{0}}state nto |
| Ingress Protection (Pem hauv ntej). | Feem ntau IP30-IP40; yooj yim rau ya raws thiab plua plav | IP54-IP65 tiv thaiv pem hauv ntej nto | IP54-IP65; tag nrho hermetic pem hauv ntej nto |
| Thermal Dissipation | Thaum tshav kub kub dissipates los ntawm txhuas thav duab thiab solder pads | Slower pem hauv ntej dissipation vim cov kua nplaum txheej rwb thaiv tsev | Superior; direct substrate contact txo thermal kuj |
| Optical Uniformity | Point- qhov chaw lub teeb; siab dua glare thiab moiré kev pheej hmoo | Diffused; nplaum txheej minimizes graininess | Nto- lub teeb ci; dav saib cov ces kaum thiab softer illumination |
| Field Serviceability | Siab; LEDs ib leeg tuaj yeem raug tshem tawm thiab hloov pauv | nyuaj; tshem tawm cov nplaum los hloov ib qho LEDs yog qhov nyuaj | Module- yuav tsum tau hloov qib; Hoobkas rework xav tau rau chips |
| Tus nqi tsim khoom | Lub hauv paus / Nqis - zoo | Nruab nrab (SMD tus nqi + cov khoom siv potting & txheej txheem) | Kev nqis peev ntau dua pib, sib npaug ntawm ultra-cov suab zoo |
4. Cov kev ua haujlwm tseem ceeb sib txawv
A. Kev cuam tshuam thiab kev ntseeg tau
Hauv kev teeb tsa kev xauj tsev, chaw muag khoom, lossis kev teeb tsa siv tau, zoo -pitch SMD qhia nquag raug kev txom nyem los ntawm "lamp poob" (diodes shearing tawm vim muaj kev cuam tshuam). GOB tau tsim tshwj xeeb los txo qhov teeb meem no, ua kom cov neeg kho tshuab shear muaj zog heev. COB muab kev sib piv lossis kev cuam tshuam zoo dua vim tias cov chips tau kos hauv qab ib qho chaw resin nto yam tsis muaj cov ceg tawv.
B. Thermal Management thiab Lifespan
Thermal accumululation degrades diode efficiency thiab ua rau tsis sib xws xim hloov lub sij hawm:
- SMDhloov cov cua sov los ntawm nws cov hlau lead rau hauv PCB; thermal kuj yog nruab nrab.
- GOBntxiv ib txheej thermal insulating rau saum cov diodes. Thaum txoj kev rov qab cua sov dissipation tseem tsis hloov pauv, pem hauv ntej - lub ntsej muag lub ntsej muag cua sov tuaj yeem ua rau me ntsis ua haujlwm kub kub yog tias PCB thermal ntawm kev tsim tsis txaus.
- COB (tshwj xeeb tshaj yog Flip-Chip COB).bonds lub liab qab tuag ncaj qha mus rau tooj liab Circuit Court txheej, tshem tawm cov kev sib txuas ntawm cov hlau thiab txhuas thav duab tsis kam. Txoj kev ncaj qha thermal no ua rau qis dua qhov kub thiab txias, txhawb kev ua neej ntev dua thiab txo cov wavelength drift.
C. Kev ua haujlwm kho qhov muag thiab qhov muag nkees
SMD modules tso lub teeb raws li cov ntsiab lus sib txawv, uas tuaj yeem ua rau pom kev qaug zog thaum lub sijhawm saib ntev thiab ua kom pom cov qauv moiré thaum kaw los ntawm studio koob yees duab. COB hloov cov ntsiab lus tsis sib xws rau hauv kev teeb pom kev tsis tu ncua, ua kom cov zis softer, siab dua qhov sib piv (sib sib zog nqus dub), thiab pom lub kaum sab xis siab tshaj 160℃nrog tsawg xim hloov. GOB muab cov nyhuv nruab nrab ntawm qhov pom: cov potting resin me ntsis scatters taw tes- qhov chaw lub teeb, txo qhov ci ntsa iab tab sis yuav tsum muaj kev tswj xyuas nruj nruj kom tsis txhob yellowing ntau xyoo ntawm UV raug.
5. Kev tu thiab kev pabcuam
- SMD ua:Kev kho thaj chaw yog ncaj nraim. Cov kws tshaj lij uas tsim nyog tuaj yeem hloov tus neeg hlawv - tawm diodes ntawm - qhov chaw siv qhov kub - huab cua rework chaw nres tsheb.
- GOB:Kev kho hauv zos yog qhov nyuaj. Kev khawb los ntawm kev kho potting resin los hloov ib lub diode feem ntau tawm cov caws pliav lossis resin discoloration, ua module-theem hloov cov qauv siv tau zoo.
- COB:Kev kho tus kheej nti tsis tuaj yeem ua rau ntawm -qhov chaw vim tias yuav tsum muaj kev sib txuas ntawm microscopic. Kev pab cuam tag nrho ntawm kev sib pauv hloov pauv sai sai, nrog cov vaj huam sib luag puas rov qab los tswj cov chaw huv huv rau kev kho qhov muag thiab lub Hoobkas- theem rework.
6. Kev Xaiv Cov Cai rau Kev Siv Engineering
Xaiv SMDthaum:
Lub pixel suab yog ntau dua 1.8mm.
Qhov project pob nyiaj siv yog qhov kev txwv tseem ceeb.
Hauv -site, cov khoom siv - theem kho yog tsim nyog.
Cov zaub yog mounted tawm ntawm ncav cuag lub cev ncaj qha.
Xaiv GOBthaum:
Cov zaub ua haujlwm nyob rau hauv qhov chaw muaj kev pheej hmoo siab (cov xwm txheej xauj tsev, cov ntawv thov kov, khw muag khoom, qis- theem phab ntsa mounting).
Ib lub suab ntawm P1.2 thiab P1.9 yog qhov yuav tsum tau, tab sis cov peev nyiaj tsis tuaj yeem ua rau tag nrho COB architectures.
Txhim kho cov dej noo, kev sib tsoo, thiab kev tiv thaiv plua plav yog xav tau ntawm tus qauv SMD pob nyiaj siv.
Xaiv COBthaum:
Lub hom phiaj lub suab yog P1.2 lossis me dua (P0.9, P0.7, thiab lwm yam).
Kev teeb tsa yog lub hom phiaj- tseem ceeb (cov chaw hais kom ua, chav tswj kev tshaj tawm, siab- chav tswj hwm kev lag luam kawg) thov kom muaj kev ntseeg siab tas li 24/7.
Qhov siab tshaj plaws optical sib piv, dav - lub kaum ntse ntse xim fidelity, thiab tsawg lub koob yees duab moiré yog qhov yuav tsum tau ua.